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Room-temperature-deposited dielectrics and superconductors for integrated photonics. Public Deposited

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https://scholar.colorado.edu/concern/articles/f1881m655
Abstract
  • We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating low cost and high scalability. We have shown low-loss SiN waveguides, high-Q ring resonators, critically coupled ring resonators, 50/50 beam splitters, Mach-Zehnder interferometers (MZIs) and a process-agnostic fiber packaging scheme. We have further explored the utility of this process for applications in nonlinear optics and quantum photonics. We demonstrate spectral tailoring and octave-spanning supercontinuum generation as well as the integration of superconducting nanowire single photon detectors with MZIs and channel-dropping filters. The packaging approach is suitable for operation up to 160 °C as well as below 1 K. The process is well suited for augmentation of existing foundry capabilities or as a stand-alone process.
Creator
Date Issued
  • 2017-05-01
Academic Affiliation
Journal Title
Journal Issue/Number
  • 9
Journal Volume
  • 25
File Extent
  • 10322-10334
Publisher
Last Modified
  • 2019-12-05
Identifier
  • PubMed ID: 28468405
Resource Type
Rights Statement
DOI
ISSN
  • 1094-4087
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