Citation Formats
MLA
Cheng, Jen-Hau. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-grown Nanowire Devices.
APA
Cheng, J. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-Grown Nanowire Devices.
Chicago
Cheng, Jen-Hau. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-Grown Nanowire Devices.