Citation Formats

MLA

Cheng, Jen-Hau. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-grown Nanowire Devices.

APA

Cheng, J. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-Grown Nanowire Devices.

Chicago

Cheng, Jen-Hau. Atomic Layer Deposition Enabled Interconnect and Packaging Technologies for As-Grown Nanowire Devices.